Application of electroless Cu deposition for preparation of Al2O3/Cu composites
Jerzy Bieliński*, Alicja Bielińska*, Zuzanna Cieśla*, Katarzyna Konopka**, Damian Rosłoniec** *Politechnika Warszawska, Wydział Chemiczny, ul. Noakowskiego 3, 00-664 Warszawa **Politechnika Warszawska, Wydział Inżynierii Materiałowej, ul. Wołoska 141, 02-507 Warszawa
Quarterly No. 1, 2006 pages 62-67
DOI:
keywords: electroless Cu deposition, nonmetallic solid and powder substrates, Al2O3/Cu composites
abstract The investigation of the electroless catalytical copper deposition on ceramic substrates and characterization of obtained coatings and powder composites is presented in this work. The electroless Cu-metallization was carried on the mullite solid cylinders, polymer foil and alumina powders with different grains (from 75 μm to 13 nm). The influence of the particular parameters of electroless metallization on the Cu deposition rate and on the metallic phase content in the Al2O3/Cu powder composite was determined. In investigated alkaline electroless copper baths the concentration of Cu-salt, HCHO, EDTA, NaOH, temperature and deposition time was the subject of changes. It was find out that temperature and Cu(II) concentration are the most important deposition parameters in case of solid and powder substrate metallization. For powder coating additionally the NaOH concentration is also important factor. The obtained Al2O3/Cu composite powders contained from 5 to over 95% of Cu. The structural and morphological characterization of the Cu coatings and composite powders was carried on SEM and AFM microscopy. The uniform deposition of microcrystalline Cu layers on coated ceramic substrate was confirmed, what is the necessary condition for next sintering step in composite application.