Composites layers Cu+W produced electrochemically
Maria Trzaska, Wojciech Lisowski Politechnika Warszawska, Wydział Inżynierii Materiałowej, ul. Wołoska 141, 02-507 Warszawa
Quarterly No. 2, 2005 pages 81-84
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abstract This paper is focused on studies of composites layers produced by electrochemical method on a copper substrate. The realized investigations comprise the settlement of optimal parameters of production process of the layers, and characteristics of the structure of material of the produced composite layers. The results of investigations of surface and morphology topography (Figs 1, 2) as well as of the structure of produced layers (Figs 3, 4), received with the method of electron scanning microscopy are presented and documented. An estimation of internal structure of layers, their thickness (Figs 3, 4) and distribution of tungsten particles in the whole volume of composite material (Fig. 6) are reported. These investigations show that tungsten powder in the whole volume of the composite layer is disposed uniformly and its introduction into the layer material causes considerable change of topography in comparison to layer made from copper exclusively. The method of quantitative metallography and computer analysis of images were applied to determine the content of the dispersed phase of tungsten in the composite material (Fig. 5). The analysis of chemical constitution shows 30% atomic part of tungsten in the whole composite layer. Computer analysis shows the volumetric part VV of tungsten in the layer material equal 15%, as well as shares superficial rate SV in order of 0.23 1/mm. The microhardness of produced copper and composite layers obtained by the Vickers method (Tab. 1) was also measured. The addition of tungsten powder caused an important growth of the microhardness of the composite material and carried out 125 HV0.05 in comparison to copper layer - 80 HV and substrate - 85 HV, respectively. Key words: electrochemical method, composite Cu+W layers, structure of layers