Epoxy-vinyl ester materials
Ryszard Pilawka, Sandra Paszkiewicz
Quarterly No. 1, 2011 pages 66-69
DOI:
keywords: epoxy-vinylester composition/composites, epoxy resin, vinylester resin, Resin Transfer Moulding, Interpenetrating Polymer Network
abstract The work is the continuation of an investigation conducted in the Polymer Institute concerning the modification of epoxy resins with the aim of utilizing these materials for production by means of Resin Transfer Moulding (RTM). In the work, the mechanical strengths and glass transition temperature were reported for epoxy-vinylester compositions/composites. The following kinds of epoxy resin were used: Epidian 6 or Ampreg 22 hardened with 1-ethylimidazole and vinylester resins; VE-2MM or Atlac 580 ACT cured with t-butyl perhydroxide. In an earlier paper, we proved that modified epoxy resin with vinylester resin causes a decrease in viscosity and makes it possible to form an Interpenetrating Polymer Network (IPN). This described modification leads to an improvement of mechanical durability, especially with a content of vinylester resin in the range of 30÷50 wt.%. The selected curing agents made it possible to obtain a Simultaneous Interpenetrating Network for the components.